Sputter system | e beam evaporator | PLD | Pulsed laser deposition
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Dragon Line - 6000: E-Beam - Thermal - Sputter - IBE - RIE (with Glove Box)

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AdNaNoTek's Dragon Line - 6000 is a linear integrated UHV deposition systems which include the following: Electron Beam Evaporator (EBE-1), Thermal Evaporator (TE-3), and Magnetron Sputtering (MSD) coating tools; with Ion Beam Etching, Reactive Ion Etching (RIE) and Glove Box.
Researchers can operate the systems individually or combine series of deposition processes through the UHV Linear Transfer System (LTS).
All systems are UHV compatible (5E-10torr) and the transfer system can be extended indefinitely


Integrated Components

UHV Ion-Beam Etching (IBE)

MAIN SPECIFICATIONS:
  • Cylindrical dome shape chamber
  • Substrate size: 4-in
  • Base pressure 5E-10torr
  • 360° rotation and ±45° tilt manipulator
  • KRI RF-ICP ion source with control software
  • Water cooling
  • 1200l/s Pfeiffer turbo pump
  • MFC and Pressure control system
  • Full range vacuum gauge
  • Industrial computer with 23" touchscreen
  • FBBear system control software
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UHV-Magnetron Sputtering (MSD - 24)

MAIN SPECIFICATIONS:
  • Cylindrical dome shape chamber
  • Substrate size: 4-in
  • Base pressure 5E-10torr
  • 4-axis (XYZR) manipulator
  • Heating temperature up to >1000°C
  • 3-6 magnetron sputtering sources
  • RF and DC Power Supplies
  • Water cooling
  • 700l/s Pfeiffer turbo pump
  • Differential pumping mechanism
  • MFC and Pressure control system
  • Full range vacuum gauge
  • Industrial computer with 23" touchscreen
  • FBBear system control software
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Reactive Ion Etching (RIE-6)

MAIN SPECIFICATIONS:
  • Box type chamber
  • Base pressure 5E-7torr
  • 4-in substrate platen (max 8-in)
  • Gas Shower head
  • 6 MFC controlled gas lines
  • Axial symmetry evacuation design
  • Pressure control system
  • 700l/s Pfeiffer turbo pump
  • Differential pumping mechanism
  • Full range vacuum gauge
  • Industrial computer with 23" touchscreen
  • FBBear system control software
  • optional: ICP-RIE
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Thermal Evaporator (Metal)

MAIN SPECIFICATIONS:
  • Cylindrical dome shape chamber
  • Base pressure 5E-10torr
  • 4-axis (XYZR) manipulator
  • 2 Thermal Boats around 1400C
  • Dual Sensor Thickness monitor
  • 700l/s Pfeiffer turbo pump
  • Full range vacuum gauge
  • Industrial computer with 23" touchscreen
  • FBBear system control software

Thermal Evaporator (SiO)

MAIN SPECIFICATIONS:
  • Cylindrical dome shape chamber
  • Base pressure 5E-10torr
  • 4-axis (XYZR) manipulator
  • Chimney type evaporator around 2000C
  • Dual Sensor Thickness monitor
  • 700l/s Pfeiffer turbo pump
  • Full range vacuum gauge
  • Industrial computer with 23" touchscreen
  • FBBear system control software

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Optional

  • Pre-heating (degassing) system
  • Automatic transferring system
  • ARPES analyzer system
  • SEM
  • STM
  • IBSD

Integrated UHV Systems
Ultrahigh Vacuum (UHV) Systems
UHV Deposition Systems
Integrated UHV Systems
Customized UHV Systems

UHV Technologies
Thin-film Deposition
Surface Science
Laser Heating Systems

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© Copyright 2014 AdNaNoTek Corporation. All rights reserved.
  • AdNaNotek
    • News
    • Online Catalogs
    • Articles >
      • Scientific Papers Generated
      • Events
    • UHV Technology >
      • E-Beam Research
      • CIGS Research
      • UHV Deposition Techniques >
        • Molecular Beam Epitaxy ( Laser MBE)
        • Pulsed Laser Deposition (PLD)
        • Magnetron Sputtering Deposition (MSD)
        • Electron Beam Evaporator (EBE)
        • Ion-Beam Sputter Deposition (IBSD)
        • Plasma Enhanced Atomic Layer Deposition (PEALD)
      • FBBear System Control Software
      • Useful Data
    • Profile
  • PVD
    • Industrial >
      • Large Sputter
      • Industrial E-Beam
    • MBE
    • PLD
    • SPUTTER
    • E-Beam evaporator
    • IBSD and IBE
    • Josephson Junction E-Beam(Qubit manufacture)
    • Customized UHV Systems
  • Laser Heater
  • UHV Cluster System
  • ALD and CVD
    • Etching >
      • RIE 80
      • Plasma-80ICP
      • Remote Plasma source
    • ALD (Atomic Layer Deposition)
  • UHV design & components
    • Substrate Manipulator
    • Chambers
    • Custom Weldments
    • Isolation Vacuum Gate Valves
    • Shielding Gate Valves
    • XYZ stage
    • Transfer Arms
  • Deposition systems_N
    • EBV_N
    • MBE_N
    • Magnetron Sputtering_N
    • PLD_N
    • Ion Beam Sputter Deposition_N
  • Direct Laser Writer_N
  • Media
  • Contact