E-beam evaporation, can call one of thermal evaporation process, uses an electron beam of several kilo Voltage energy onto the source material and melting this material to be vaporized, and then deposited on a substrate to form a thin film. E-beam evaporation has a better deposition rate than sputtering.
Advantage:
Excellent uniformity
Almost all the material
Material impurity is very low
Deposition rate is high
Good directionality
Possible work with ion source
Advantage:
Excellent uniformity
Almost all the material
Material impurity is very low
Deposition rate is high
Good directionality
Possible work with ion source
Dual E-Beam Titanium Thin-Film Data Analysis
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Achievement AdNanoTek's Dual E-beam Evaporator fabricated 4-inch Ti thin-film with high degree of homogeneity, and uniformity of ±1.7%. |
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Sputter technology is a plasma-based coating method where positively charged energetic ions bombard a negatively biased target material, the target atoms from the target that are then deposited onto a substrate. This process occurs in a closed magnetic field to trap electrons and boost efficiency. This method produces good film quality and the highest scalability of any PVD type. It produce several meters size coating.
Advantage:
Excellent uniformity
All the material no matter metal or non conductive material
Material impurity is very low
Deposition rate is low
Possible in small to very large area deposition
Advantage:
Excellent uniformity
All the material no matter metal or non conductive material
Material impurity is very low
Deposition rate is low
Possible in small to very large area deposition
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