​EBS-150

• Wafer size – up to 8 in
• Base pressure  E(-8) torr
• Manipulator could be tilted during rotation by ±75 degrees
• 3 pockets capacity E-beam gun
• Ion beam assisted deposition (opt.)
• Dedicated FBBEAR software integrates an easy access to real time growth parameters, recipe editing, data logging and substrate transfer control

---

EBS-300

• Wafer size – up to 8 in
• Base pressure E(-8) torr
• Manipulator could be tilted during rotation by ±75 degrees
• Two E-Beam guns with 3 pockets capacity  each
• Ion beam assisted deposition (opt.)
• Dedicated FBBEAR software integrates an easy access to growth parameters, recipe editing, data logging and substrate transfer control

---

Josephson junction E-beam deposition systems for quantum computER application

---

JEB-2

• Wafer size – up to 8 inch
• Base pressure E(-8) torr
• Manipulator could be tilted by ±75 degrees during rotation
• Ion beam milling chamber
• E-Beam deposition chamber
• Dedicated FBBEAR software integrates an easy access to growth parameters, recipe editing, data logging and substrate transfer control

---

JEB-3

• Wafer size – up to 8 inch
• Base pressure E(-8) torr
• Manipulator could be tilted by ±75 degrees during rotation
• Ion beam milling chamber
• E-Beam deposition chamber
• Oxidation chamber
• Dedicated FBBEAR software integrates an easy access to growth parameters, recipe editing, data logging and substrate transfer control

---

JEB-4

• Wafer size – up to 8 inch
• Base pressure E(-8)  torr
• Manipulator could be tilted by ±75 degrees during rotation
• Load-lock chamber
• Ion beam milling chamber
• E-Beam deposition chamber
• Oxidation chamber
• Additional effusion cell could be installed
• Resistive or laser substrate heater
• Glove box for samples loading (option)
• Dedicated FBBEAR software integrates an easy access to growth parameters, recipe editing, data logging and substrate transfer control

---

JEB-Diamond

• Wafer size – up to 8 inch
• Base pressure E(-8) torr
• Manipulator could be tilted by ±75 degrees during rotation
• Load-lock chamber
• Ion beam milling chamber
• E-Beam deposition chamber
• Oxidation chamber
• Transfer chamber and robot
• Additional effusion cell could be installed
• Resistive or laser substrate heater
• Dedicated FBBEAR software integrates an easy access to growth parameters, recipe editing, data logging and substrate transfer control

Option

• UHV sputter
• Annealing chamber
• ALD and CVD
• ICP RIE
• In evaporator
• Glove box

123
​Paragraph. 按此處以編輯.