Sputter system | e beam evaporator | PLD | Pulsed laser deposition

Ion Beam Sputter Deposition


Adnanotek’s Ion Beam Sputtering Deposition (IBSD) systems providing deposition of large-scale thin-films with extremely high quality and great repeatability. IBSD utilizes ion source to generate a focused ion beam directed at the target to be sputtered. Since the target material is ablated by momentum transfer rather than a chemical or thermal process, a wide range of materials can be deposited on the substrate (whether it is conductor or insulator). Target holders are designed to have multiple faces providing deposition of different targets by means of rotation. The formation of unique custom designed pattern could be further realized by adding the mask option. ​
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​IBSD Sputter

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  • Base pressure:​ 5E(-10) torr
  • Thickness Monitor
  • Gridded Ion source (IBSD)
  • End hall Ion source (IBAD)
  • Water cooling target for IBSD
  • Dual Mask
  • Down stream control
  • Upstream control
  • 4 Sputter cathodes

IBSD-20

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  • Custom type SS316L electro-polished chamber
  • 5E(-7) torr base pressure
  • Substrate size max 4 in
  • 4 axes sample manipulator (XYZ and rotation) with water cooling
  • Thermal evaporator with 3 boats
  • Ion beam deposition and assist source (Gridded RFICP/KDC; or gridless EH)
  • 4 sputter cathodes
  • Cube type target assembly
  • Thickness monitor
  • FBBEAR entire system control software

Ion Beam Etching System

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  • Ideal tool for surface cleaning prior film deposition
  • Providing reasonable etching rate regardless of substrate nature (conductivity)
  • Working gas: Ar, Kr, Xe, N2, O2, H2, others
  • Especially useful in case etching material forms non volatile compounds if reactive ion etching is used
  • Working pressure 5E(-4) torr
  • Base pressure 5E(-8) torr
  • Ion beam size up to 14 cm
  • Sample size up to 6 in
  • Water cooled manipulator with rotation and tilt up to ±75 degrees
  • Modular design
  • FBBEAR entire system control software

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  • AdNaNotek
    • News
    • Online Catalogs
    • Articles >
      • Scientific Papers Generated
      • Events
    • UHV Technology >
      • E-Beam Research
      • CIGS Research
      • UHV Deposition Techniques >
        • Molecular Beam Epitaxy ( Laser MBE)
        • Pulsed Laser Deposition (PLD)
        • Magnetron Sputtering Deposition (MSD)
        • Electron Beam Evaporator (EBE)
        • Ion-Beam Sputter Deposition (IBSD)
        • Plasma Enhanced Atomic Layer Deposition (PEALD)
      • FBBear System Control Software
      • Useful Data
    • Profile
  • PVD
    • Industrial >
      • Large Sputter
      • Industrial E-Beam
    • MBE
    • PLD
    • SPUTTER
    • E-Beam evaporator
    • IBSD and IBE
    • Josephson Junction E-Beam(Qubit manufacture)
    • Customized UHV Systems
  • Laser Heater
  • UHV Cluster System
  • ALD and CVD
    • Etching >
      • RIE 80
      • Plasma-80ICP
      • Remote Plasma source
    • ALD (Atomic Layer Deposition)
  • UHV design & components
    • Substrate Manipulator
    • Chambers
    • Custom Weldments
    • Isolation Vacuum Gate Valves
    • Shielding Gate Valves
    • XYZ stage
    • Transfer Arms
  • Deposition systems_N
    • EBV_N
    • MBE_N
    • Magnetron Sputtering_N
    • PLD_N
    • Ion Beam Sputter Deposition_N
  • Direct Laser Writer_N
  • Media
  • Contact