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Chemical Vapor Deposition System
CVD Series

Microwave Remote Plasma Enhanced Chemical vapor Deposition (mw-pecvd)

图片
AdNaNoTek's Microwave Plasma Enhanced Chemical Vapor Deposition (MW-PECVD) is a deposition technique used for producing high quality epitaxial (atomic layer) thin film using controlled and programmed gas precursors inputs. This PECVD system is uniquely equipped with Electron Cyclotron Resonance (ECR) which uses microwave to produce successive ionization, vibrational excitation, and collision among gas molecules, and consequently generating plasma. Sufficient precursor units are provided to introduce deposition materials unto the substrate using a sophisticated gas control panel. The deposition chamber and substrate manipulator provides precise control of vacuum condition and substrate temperature to ensure high quality deposition process. Since the substrate heater can be heated up to preset temperature.
In addition, precise control and high stability is achieved by making the process automated with the use of the FBBEAR control software. The FBBEAR control software, provides complete data logging, precise parameter tuning  which allows user to have easy operation and reliable experimental repeatability.

AdNaNotek can design and manufacture any types of CVD systems:
1) Rapid Thermal Atomic Layer Deposition (CVD);
2) Low Pressure Atomic Layer Deposition (LPCVD); and
3) Plasma Enhanced Atomic Layer Deposition (PECVD)
   a. Inductively Coupled Plasma (ICP), or  
   b. Electron Cyclotron Resonance (ECR)


MAIN SPECIFICATIONS:

  • Custom-type SS316L electro-polished chamber
  • 1E-6 Torr Base Pressure
  • 6-in substrate platen
  • Resistive heating plate with sample heating temperature: 500°C  (1000 degree C for Thermal CVD)
  • ​Electron Cyclotron Resonance (ECR) plasma source
  • 800W microwave generator
  • Pressure control system: upstream
  • FBBeam System Control Software

 Microwave ECR Plasma Generator

  • 800W microwave generator
  • Electron Cyclotron Resonance (ECR) plasma source

Inductively Coupled Plasma (ICP) can also be used for Plasma Generation instead of ECR
Picture

System Control Software

FBBEAR software is a multi-functional software to control the whole PEALD system, i.e. Manipulator rotation speed, heating program, etc.

FBBEAR can control EUROTHERMO2408 to control, tune and save multi-PID parameters for laser/filament heater for the best accuracy of different substrate temperature requirements.

FBBEAR’s Deposition wizard make it hassle free to set, customize and save your experimental recipe and fully automatize the deposition processes. This also allows easy repetition of the deposition process having same experimental parameters. In addition, it also allows recording of data log in order to review past deposition parameters.


Optional

  • Preparation chamber
  • Turbomolecular pump for post-deposition evacuation mechanism
  • High temperature precursor heaters
  • Downstream pressure control system
  • Batch process

Related Links:

Technologies: PEALD
Brochures: PEALD
UHV Deposition Systems
Ultrahigh Vacuum (UHV) Systems
UHV Deposition Systems
Integrated UHV Systems
Customized UHV Systems

UHV Technologies
Thin-film Deposition
Surface Science
Laser Heating Systems

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  • AdNaNotek
    • News
    • Online Catalogs
    • Articles >
      • Scientific Papers Generated
      • Events
    • UHV Technology >
      • E-Beam Research
      • CIGS Research
      • UHV Deposition Techniques >
        • Molecular Beam Epitaxy ( Laser MBE)
        • Pulsed Laser Deposition (PLD)
        • Magnetron Sputtering Deposition (MSD)
        • Electron Beam Evaporator (EBE)
        • Ion-Beam Sputter Deposition (IBSD)
        • Plasma Enhanced Atomic Layer Deposition (PEALD)
      • FBBear System Control Software
      • Useful Data
    • Profile
  • PVD
    • Industrial >
      • Large Sputter
      • Industrial E-Beam
    • MBE
    • PLD
    • SPUTTER
    • E-Beam evaporator
    • IBSD and IBE
    • Josephson Junction E-Beam(Qubit manufacture)
    • Customized UHV Systems
  • Laser Heater
  • UHV Cluster System
  • ALD and CVD
    • Etching >
      • RIE 80
      • Plasma-80ICP
      • Remote Plasma source
    • ALD (Atomic Layer Deposition)
  • UHV design & components
    • Substrate Manipulator
    • Chambers
    • Custom Weldments
    • Isolation Vacuum Gate Valves
    • Shielding Gate Valves
    • XYZ stage
    • Transfer Arms
  • Deposition systems_N
    • EBV_N
    • MBE_N
    • Magnetron Sputtering_N
    • PLD_N
    • Ion Beam Sputter Deposition_N
  • Direct Laser Writer_N
  • Media
  • Contact